DUKE UNIVERSITY
This proposal presents a plan to acquire a silicon deep reactive ion etching
(DRIE) system to be installed and operated within the Shared Materials Instrumentation Facility
(SMIF) at Duke University. The proposed system represents industry-leading DRIE processing
system, capable of performing a wide range of silicon etches that include high etch rate etching
(over 35µm/min), high aspect ratio etching (over 70:1), deep sub-micron feature etching in the
nanometer scale, smooth sidewall etch (with roughness <20nm), minimal undercutting of siliconon-
insulator (SOI) substrates, flexible sidewall profile control, and highly selective etching
(selectivity over 240:1 to photoresist). Combined with the electron beam lithography and other
cutting-edge fabrication capability already available in SMIF, this system will provide the
current users of SMIF a unique opportunity for silicon patterning and integration at the nanoscale.
With the addition of the proposed tool, the current users will be able to realize unique devices
and integrated system solutions, including optical micro-electromechanical systems (MEMS),
metamaterials at the micro- and nano-scale, photonic crystals and nanophotonic devices, micropower
generators, precision packaging solutions for optical/electronic devices and systems,
terahertz sources, microfluidic devices, and low-cost patterning technologies using molds and
stamps. The diversity of research projects that this tool can immediately enable demonstrates the
multidisciplinary impact that it will have on a highly collaborative research environment already
established in SMIF at Duke University. Furthermore, the flexible silicon processing capability
available on campus will be leveraged to create hands-on educational program consistent with
the Integrated Sensing and Information Processing (ISIP) theme that was at the heart of the
curriculum reform at the Electrical and Computer Engineering Department at Duke.
The proposed system will be installed, operated and maintained within SMIF infrastructure.
SMIF already has (1) full-time engineering staff that can support the user training, operation and
maintenance of the equipment, (2) cost recovery mechanism through user fees that will provide
the financial resources to service the equipment, and (3) scheduling software to manage equitable
distribution of equipment time among users. This arrangement ensures a sustainable long-term
operation of the tool, while providing access to a very wide range of interested users and
guarantee the investment can serve as a regional resource.
Broader Impacts: The current users of SMIF include researchers from several universities,
government research agencies and non-profit institutions, as well as startup companies that
cannot afford to operate their own fabrication facility. Addition of new capabilities to SMIF will
(1) provide graduate students and postdoctoral researchers with opportunities to expand their
research experience that will help train a higher quality work force, and (2) enable local startup
companies to develop their core technology that will lead to job creation and economic growth:
there are several companies that stand to immediately benefit from the availability of the silicon
etching capability. The addition of such a versatile tool will stimulate the creation of new
research programs and product ideas that leverage the capability. In this sense the equipment will
serve as a collaborative focal point to channel these activities in the region. The PI and the ECE
Department at Duke University plans to create new laboratory course that utilize the silicon
fabrication process made available by the addition of the etching capability, which will provide
the students with a hands-on fabrication experience. The PI, Co-PIs and the institution (Duke)
have a successful track record of attracting and nurturing female and minority scientists and
engineers, and will continue the efforts through this program.
| AWARD OVERVIEW |
| Award Number |
0959695 |
Funding Agency |
National Science Foundation |
| Total Award Amount |
$450,000 |
Project Location - City |
Durham |
| Award Date |
03/08/2010 |
Project Location - State |
NC |
| Project Status |
Completed |
Project Location - Zip |
27705-0000
|
| Jobs Reported |
0.00 |
Congressional District |
04 |
| Project Location - Country |
US |
|
|
Recipient Information
(Grants)
| Recipient Information (Grants) |
|
Recipient Name
|
DUKE UNIVERSITY |
| Recipient DUNS Number |
044387793
|
| Recipient Address |
2200 W MAIN ST STE 710 |
| Recipient City |
DURHAM |
| Recipient State |
North Carolina |
| Recipient Zip |
27705-4677 |
| Recipient Congressional District |
04 |
| Recipient Country |
USA |
Required to Report Top 5 Highly Compensated Officials |
No |
Projects and Jobs Information
| Projects and Jobs Information |
| Project Title |
MRI-R2: Acquisition of High Performance Deep Reactive Ion Etching System for Multidisciplinary Engineering Applications |
| Project Status |
Completed |
| Final Project Report Submitted |
Yes |
| Project Activities Description |
Colleges, Universities, and Professional Schools |
| Quarterly Activities/Project Description |
The silicon deep reactive ion etching system was delivered to Duke in early September, and was installed through October. The engineers from the vendor spent three weeks on Duke campus to complete installation and bring up etching processes to verify the system operation. As of October 2010 the system is fully operational, and users have started utilizing it for their applications. The project is 100% complete as of November 2010. |
| Jobs Created |
0.00 |
| Description of Jobs Created |
N/A |
Purchaser Information
(Grants)
| Purchaser Information |
| Contracting Office ID |
Not Reported |
| Contracting Office Name |
Not Available |
| Contracting Office Region |
Not Available |
| TAS Major Program |
49-0101 |
| Award Information |
| Award Date |
03/08/2010 |
| Award Number |
0959695 |
| Order Number |
|
| Award Type |
Grants |
| Funding Agency ID |
49 |
| Funding Agency Name |
National Science Foundation |
| Funding Office Name |
Not Available |
| Awarding Agency ID |
49 |
| Awarding Agency Name |
National Science Foundation |
| Amount of Award |
$450,000 |
| Funds Invoiced/Received |
$436,100 |
| Expenditure Amount |
$450,000 |
| Infrastructure Expenditure Amount |
$0 |
| Infrastructure Purpose and Rationale |
Not Reported |
| Infrastructure Point of Contact Name |
Not Reported |
| Infrastructure Point of Contact Email |
Not Reported |
| Infrastructure Point of Contact Phone |
Not Reported |
| Infrastructure Point of Contact Address |
Not Reported |
| Infrastructure Point of Contact City |
Not Reported |
| Infrastructure Point of Contact State |
Not Reported |
| Infrastructure Point of Contact Zip |
Not Reported |
Product or Service Information
(Grants)
| Product or Service Information |
| Primary Activity Code |
611310 |
| Activity Description |
Colleges, Universities, and Professional Schools |
| Sub-Awards Information |
| Sub-awards to Organizations |
0 |
| Sub-award Amounts to Organizations |
$0 |
| Sub-Awards to Individuals |
0 |
| Sub-Award Amounts to Individuals |
$0 |
| Number of Sub-awards less than $25,000/award |
0 |
| Amount of Sub-awards less than $25,000/award |
$0 |
| Number of payments to vendors greater than $25,000 |
2 |
| Total Amount of payments to vendors greater than $25,000/award |
$615,000 |
| Number of payments to vendors less than $25,000/award |
4 |
| Total Amount of payments to vendors less than $25,000/award |
$23,388 |
SPP Process Technology (Foreign Entity, NP182TA00) - Award Number 0959695 - SPP Process Technology (Foreign Entity, NP182TA00)
| Award Number |
0959695 |
| Sub-Award Number |
N/A |
| Vendor DUNS Number |
Not reported |
| Vendor HQ Zip Code + 4 |
00000-0000 |
| Vendor Name |
SPP Process Technology (Foreign Entity, NP182TA00) |
| Product and Service Description |
Pegasus Deep Reactive Ion Etch System |
| Payment Amount |
$184,500 |
SPP Process Technology (Foreign Entity, NP182TA00) - Award Number 0959695 - SPP Process Technology (Foreign Entity, NP182TA00)
| Award Number |
0959695 |
| Sub-Award Number |
N/A |
| Vendor DUNS Number |
Not reported |
| Vendor HQ Zip Code + 4 |
00000-0000 |
| Vendor Name |
SPP Process Technology (Foreign Entity, NP182TA00) |
| Product and Service Description |
Pegasus Deep Reactive Ion Etch System |
| Payment Amount |
$430,500 |
| Location Information |
| Latitude, Longitude |
36º 1' 34",
-78º 58' 53" |
| Congressional District |
04 |
| Address 1 |
2200 West Main Street, Suite 300 |
| Address 2 |
|
| City |
Durham |
| County |
Durham |
| State |
NC |
| Zip |
27705-0000 |
|
 |